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Julia Gersey

ECE Ph.D. Student
University of Michigan
gersey [at] umich [dot] edu

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About Me

I’m an Electrical & Computer Engineering Ph.D. student at the University of Michigan, advised by Pei Zhang as a member of the NohPei Lab. I’m majoring in Embedded Systems with a focus on building hardware, systems, and wireless sensing networks to solve unique environmental and community issues. In my free time, I enjoy using IoT for side projects, 3D printing, transforming old devices into PCB art, and web development.

Previously, I got my B.Sc. in both Computer Science and Applied Math at Baldwin Wallace University where I was a member of the Mobile & IoT for Planet and Society (MOPS) Research Group under my advisor, Brian Krupp. (bonus: he created Ducky Weather, a simple yet elegant weather app that doesn’t sell your location data ☺ )

I currently serve as the ‘Labz’ Department Editor for the student-led ACM XRDS Magazine – email me if you are interested in having your research highlighted!

Research Interests

My undergraduate research focused on a low-cost, low-power solution for Air Quality sensing with Internet-of-Things (AQIoT), a mobile application to promote food recovery and reduce food waste, food insecurity, and student hunger on college campuses (Campus Plate), and combining machine learning models with audio/visual data to enhance a smart classroom sensing system (EduSense).

Publications

Peer-Reviewed

  1. CCSCMW
    Julia Gersey, Brian Krupp, Jonathon Fagert
    ACM Midwest Consortium for Computing Sciences in Colleges (CCSC), 2023.

  2. SenSys
    Brian Krupp, Julia Gersey, Jonathon Fagert, Tony Mlady
    ACM Conference on Embedded Networked Sensor Systems (SenSys), 2022.

  3. RACS
    Brian Krupp, Julia Gersey, Franklin Lebo
    ACM International Conference on Research in Adaptive and Convergent Systems (RACS), 2022.

Other Articles

  1. ACM XRDS
    Julia Gersey
    ACM XRDS 30, 1 (Fall 2023), 74–75.

  2. ACM SIGCAS
    Brian Krupp, Julia Gersey
    ACM SIGCAS Computers and Society, Volume 51, Issue 3

Academic News

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